Leader, Project 6: Contaminant oxidation using nanoparticulate and granular zero-valent iron
E-mail: fmdoyle@berkeley.edu
Tel: (510) 642-7594
Fax: (510) 643-8653
Mailing address:
Department of Materials Science and Engineering
210 Hearst Memorial Mining Building, Room 325
University of California
Berkeley, CA 94720-1760
Web page: http://www.mse.berkeley.edu/faculty/Doyle/Doylebio.html
Fiona Doyle
Research Interests
Solution chemistry in the processing and behavior of minerals, materials, wastes and effluents.
Recent Publications
J. W. Evans, Ran Ding, Adam Neugebauer, F. M. Doyle and V. Jiricny, "Copper electrodeposition onto extended surface area electrodes and the treatment of copper-containing waste streams", Proceedings, Metal Separation Technologies III - Prof. Holappa Honorary Symposium, Copper Mountain, Colorado, June 20-24, 2004.
Ling Wang and Fiona M. Doyle, "Known effects of pattern characteristics on copper CMP and future directions", Proceedings Ninth International Conference on Chemical-Mechanical Polish (CMP) Planarization for ULSI Multilevel Interconnections, Marina Del Rey, California, February 23-26, 2004, IMIC Headquarters, Tampa, FL.
R. Ding, J. W. Evans and F. M. Doyle "An Investigation of the Electrodeposition of Copper Relevant to the Removal of Dissolved Copper from Semiconductor Industry Waste Streams", in Electrochemistry in Mineral and Metal Processing VI, eds. R. Woods, G. Kelsall and F.M. Doyle, The Electrochemical Society, Pennington N.J., (2003), P -2003-18, ISBN: 1-56677-401-2, pp. 326-335.
Serdar Aksu, Ling Wang and Fiona M. Doyle, "Effect of hydrogen peroxide on the oxidation of copper in CMP slurries containing glycine", Journal of the Electrochemical Society, 150 (11) (2003) pp. G718-G723.
Ling Wang and Fiona M. Doyle, "Known effects of pattern characteristics on copper CMP and future directions", Proceedings Ninth International Conference on Chemical-Mechanical Polish (CMP) Planarization for ULSI Multilevel Interconnections, Marina Del Rey, California, February 23-26, 2004, IMIC Headquarters, Tampa, FL.
R. Ding, J. W. Evans and F. M. Doyle "An Investigation of the Electrodeposition of Copper Relevant to the Removal of Dissolved Copper from Semiconductor Industry Waste Streams", in Electrochemistry in Mineral and Metal Processing VI, eds. R. Woods, G. Kelsall and F.M. Doyle, The Electrochemical Society, Pennington N.J., (2003), P -2003-18, ISBN: 1-56677-401-2, pp. 326-335.
Serdar Aksu, Ling Wang and Fiona M. Doyle, "Effect of hydrogen peroxide on the oxidation of copper in CMP slurries containing glycine", Journal of the Electrochemical Society, 150 (11) (2003) pp. G718-G723.